Now shipping with NVIDIA H200 Tensor Core GPUs
Micron’s new HBM3E 12-high 36GB memory is a game-changer for your AI workloads, offering 50% more capacity and significantly lower power consumption than competitors. Now shipping to key industry partners, this memory solution is set to meet the growing demands of your AI infrastructure. Continue reading to discover how Micron’s collaboration with TSMC further strengthens its position in the market, paving the way for future advancements in your AI-enabled data center.
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Dive into the rapidly evolving landscape of AI with Micron HBM3E, the industry’s most efficient high-bandwidth memory offering up to 30% lower power than the competition. Built to advance generative AI innovation, HBM3E delivers over 1.2 TB/s bandwidth with superior power efficiency. Discover how Micron is shaping the future of AI, powering advancements in data centers, engineering, medicine, and more. All of that, all in here, with Micron HBM3E.
Sumit Sadana, executive vice president and chief business officer, Micron
Micron HBM3E is the most energy-efficient memory technology for AI needs, as measured by picojoules (pJ) per bit, with up to 30% lower power consumption than the competition.
To support AI's increasing data demands, HBM3E offers maximum throughput with the lowest power consumption to improve important data center operational expense metrics.
Micron HBM3E is the fastest, highest-capacity high-bandwidth memory to advance generative AI innovation — offered in 8-high, 24GB and 12-high, 36GB cubes — delivering over 1.2 TB/s bandwidth and superior power efficiency, all built on Micron’s leading 1β process node technology.
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